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Monday, 27 Jun 2022

Dr. Ravi Kumar Mandava

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Dr. Ravi Kumar Mandava

Dr. Ravi Kumar Mandava


Assistant Professor




Dept. of Mechanical Engineering, MANIT Bhopal, Bhopal.


Date of Birth


Educational Qualification

Ph.D (2019), Mechanical Engineering (Robotics), IIT Bhubaneswar, Bhubaneswar, Odisha.

M.E (2010), Mechanical Engineering (CAD/CAM), Andhra University, Visakhapatnam, Andhra Pradesh.

B.Tech (2008), Mechanical Engineering, Acharya Nagarjuna University, Andhra Pradesh.


 6 years in Teaching and Research


Robotics, Soft Computing & Manufacturing.



  • International Journals: 15 (SCI - 06, SCOUPS - 09)
  • International Book Chapters: 04
  • International Lecture Notes: 06
  •  National Conferences: 01
  • International Conferences: 14

                                                                 Total Published Paper: 40

Member of professional bodies

  1. IEEE Member, ID-97587699, Institute of Electrical and Electronics Engineers (IEEE)

Country        Visited


Achievements/ Awards

Received best paper award for "Study on influence of hip trajectory on the balance of a biped robot", presented at ICECIT 2015, Anantapur, Published by LNEE.

Number of Ph.D guided

01 (ongoing)

Number of P.G. Projects guided

 02 (ongoing)

Funded Projects

  1. Design and Development of Coconut Harvesting Robot”, Worth of Rs. 23,16,600/- under the Scheme for Young Scientist & Technologist, DST (Status: Ongoing)

Administrative work done

  1. Robotics lab in charge at VFSTR, Guntur, Andhra Pradesh.
  2. Technical Committee member in “TINKERING LAB” MANIT Bhopal from 24th September 2020 onwards.
  3. Core-Coordinator member of "ROLTA INCUBATION CENTER MANIT BHOPAL" from Jan 2021 onwards.

Any other information

Active Reviewer for

  1. International Journal of Dynamics and Control, Springer.
  2. International Journal of Intelligent Service Robots, Springer.
  3. International Journal of IET Control Theory and Applications, IEEE.
  4. Engineering Reports, Wiley Online Library.
  5. Journal of Control Science and Engineering, Hindawi.
  6. Silicon, Springer.